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Dual-state conversion for high-entropy and reconfigurable resistive memory-based physically unclonable functionsopen access

Authors
Park, SeoyoungNa, HyesungChoi, JaewooIsmail, MuhammadMahata, ChandreswarRyu, DonghyunKim, SungjoonLee, Jung-KyuYu, JunsuKim, Sungjun
Issue Date
Sep-2026
Publisher
ELSEVIER
Keywords
Physically unclonable function; Resistive random-access memory (RRAM); Silicon nitride interlayer; Secure key generation; Stochastic switching
Citation
Journal of Materials Science & Technology, v.266, pp 38 - 47
Pages
10
Indexed
SCIE
SCOPUS
Journal Title
Journal of Materials Science & Technology
Volume
266
Start Page
38
End Page
47
URI
https://scholarworks.dongguk.edu/handle/sw.dongguk/63536
DOI
10.1016/j.jmst.2025.11.025
ISSN
1005-0302
1941-1162
Abstract
As embedded and connected devices proliferate across smart electronics and Internet-of-Things platforms, hardware-level security has become increasingly important. Physically unclonable functions (PUFs), which leverage intrinsic process variations to generate device-specific fingerprints, offer a promising solution. Here, we propose a PUF architecture based on resistive random-access memory (RRAM) devices integrated with ultrathin silicon nitride (SiN) interfacial trapping layers. Systematic variation of the SiN thickness from 0 to 1.5 nm identifies the 0.5 nm configuration as optimal for enhancing stochastic filament formation, resulting in increased switching variability and entropy. Broad current-state distributions in both resistance states were converted into binary maps exhibiting ideal randomness metrics, including uniformity and diffusiveness near 50 % and entropy exceeding 0.94. These characteristics were maintained across multiple bit-map sizes. Furthermore, repeated SET/RESET cycling of a single memory cell enabled the generation of multiple distinct PUF responses with consistent entropy and uniqueness. These results establish interface-engineered RRAM as a high-entropy, reconfigurable, and fabrication-compatible platform for secure key generation in edge and embedded systems. (c) 2026 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
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