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Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems

Authors
Han, Ki JinAhn, Seungyoung
Issue Date
Jan-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.1, pp 3 - 4
Pages
2
Indexed
SCI
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume
8
Number
1
Start Page
3
End Page
4
URI
https://scholarworks.dongguk.edu/handle/sw.dongguk/9869
DOI
10.1109/TCPMT.2017.2787938
ISSN
2156-3950
2156-3985
Abstract
[No abstract available]
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