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Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems

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dc.contributor.authorHan, Ki Jin-
dc.contributor.authorAhn, Seungyoung-
dc.date.accessioned2023-04-28T09:42:48Z-
dc.date.available2023-04-28T09:42:48Z-
dc.date.issued2018-01-
dc.identifier.issn2156-3950-
dc.identifier.issn2156-3985-
dc.identifier.urihttps://scholarworks.dongguk.edu/handle/sw.dongguk/9869-
dc.description.abstract[No abstract available]-
dc.format.extent2-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleForeword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TCPMT.2017.2787938-
dc.identifier.scopusid2-s2.0-85040811353-
dc.identifier.wosid000422951400001-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.1, pp 3 - 4-
dc.citation.titleIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY-
dc.citation.volume8-
dc.citation.number1-
dc.citation.startPage3-
dc.citation.endPage4-
dc.type.docTypeEditorial Material-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryEngineering, Manufacturing-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
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