IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal Title
- IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN
- E 2156-3985 | P 2156-3950
Publisher
- Institute of Electrical and Electronics Engineers Inc.
Listed on(Coverage)
| JCR | 2011-2023 |
|---|---|
| SJR | 2012-2020;2022-2023 |
| CiteScore | 2011-2023 |
| SCI | 2011-2019 |
| SCIE | 2011-2024 |
| CC | 2016-2024 |
| SCOPUS | 2017-2024 |
Active
- Active
based on the information
- SCOPUS:2024-10
Country
- USA
Aime & Scopes
- IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.