Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)

Authors
Han, Ki JinAhn, Seungyoung
Issue Date
Apr-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.4, pp 509 - 510
Pages
2
Indexed
SCI
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume
8
Number
4
Start Page
509
End Page
510
URI
https://scholarworks.dongguk.edu/handle/sw.dongguk/9634
DOI
10.1109/TCPMT.2018.2820397
ISSN
2156-3950
2156-3985
Abstract
[No abstract available]
Files in This Item
There are no files associated with this item.
Appears in
Collections
College of Engineering > Department of Electronics and Electrical Engineering > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Han, Ki Jin photo

Han, Ki Jin
College of Engineering (Department of Electronics and Electrical Engineering)
Read more

Altmetrics

Total Views & Downloads

BROWSE