Monolithic 3D Integration for Vertically Stacked IGZO-Te CMOS Inverters with a Via-Hole-Less structure

김현석

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Monolithic 3D Integration for Vertically Stacked IGZO-Te CMOS Inverters with a Via-Hole-Less structure

Authors: 김현석

Issue Date: 20-Aug-2025

URI: https://scholarworks.dongguk.edu/handle/sw.dongguk/62938

Place: 대한민국

Conference Name: IMID 2025

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Appears in Collections: College of Engineering > Department of Energy and Materials Engineering > 2. Conference Papers

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Kim, Hyun Suk: College of Engineering (Department of Energy and Materials Engineering)

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