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Monolithic 3D Integration for Vertically Stacked IGZO-Te CMOS Inverters with a Via-Hole-Less structure
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김현석 | - |
| dc.date.accessioned | 2026-01-17T00:01:00Z | - |
| dc.date.available | 2026-01-17T00:01:00Z | - |
| dc.date.issued | 2025-08-20 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/62938 | - |
| dc.title | Monolithic 3D Integration for Vertically Stacked IGZO-Te CMOS Inverters with a Via-Hole-Less structure | - |
| dc.type | Conference | - |
| dc.citation.startPage | 72 | - |
| dc.citation.endPage | 72 | - |
| dc.citation.conferenceName | IMID 2025 | - |
| dc.citation.conferencePlace | 대한민국 | - |
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Related Researcher
- Kim, Hyun Suk
- College of Engineering (Department of Energy and Materials Engineering)