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모노리틱 3차원 인터커넥트의 공정 가이드라인 제공을 위한 3차원 적층 신호 분배망 모델Signal Trnasmission Network Model for Monolithic 3D Interconnects

Alternative Title
Signal Trnasmission Network Model for Monolithic 3D Interconnects
Authors
한기진
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https://scholarworks.dongguk.edu/handle/sw.dongguk/61328
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College of Engineering > Department of Electronics and Electrical Engineering > 4. Patents

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