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모노리틱 3차원 인터커넥트의 공정 가이드라인 제공을 위한 3차원 적층 신호 분배망 모델
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 한기진 | - |
| dc.date.accessioned | 2025-09-09T10:00:31Z | - |
| dc.date.available | 2025-09-09T10:00:31Z | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/61328 | - |
| dc.title | 모노리틱 3차원 인터커넥트의 공정 가이드라인 제공을 위한 3차원 적층 신호 분배망 모델 | - |
| dc.title.alternative | Signal Trnasmission Network Model for Monolithic 3D Interconnects | - |
| dc.type | Patent | - |
| dc.publisher.location | 대한민국 | - |
| dc.contributor.assignee | 동국대학교산학협력단 | - |
| dc.date.application | 2022-02-21 | - |
| dc.date.registration | 2025-01-07 | - |
| dc.type.iprs | 특허 | - |
| dc.identifier.patentRegistrationNumber | 10-2753232 | - |
| dc.identifier.patentApplicationNumber | 10-2022-0022221 | - |
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Related Researcher
- Han, Ki Jin
- College of Engineering (Department of Electronics and Electrical Engineering)