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칩렛 패키지의 전기적 설계 및 분석: 기본 개념, 동향 및 과제

Authors
한기진
Issue Date
5-Apr-2023
URI
https://scholarworks.dongguk.edu/handle/sw.dongguk/55505
Place
대한민국
Conference Date
2023-04-05 ~ 2023-04-06
Conference Name
한국마이크로전자 및 패키징학회 2023년 정기학술대회
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College of Engineering > Department of Electronics and Electrical Engineering > 2. Conference Papers

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