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칩렛 패키지의 전기적 설계 및 분석: 기본 개념, 동향 및 과제
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 한기진 | - |
| dc.date.accessioned | 2024-10-31T01:20:19Z | - |
| dc.date.available | 2024-10-31T01:20:19Z | - |
| dc.date.issued | 2023-04-05 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/55505 | - |
| dc.title | 칩렛 패키지의 전기적 설계 및 분석: 기본 개념, 동향 및 과제 | - |
| dc.type | Conference | - |
| dc.citation.startPage | 44 | - |
| dc.citation.endPage | 44 | - |
| dc.citation.conferenceName | 한국마이크로전자 및 패키징학회 2023년 정기학술대회 | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferenceDate | 2023-04-05 ~ 2023-04-06 | - |
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Related Researcher
- Han, Ki Jin
- College of Engineering (Department of Electronics and Electrical Engineering)