Transition of short-term to long-term memory of Cu/TaOx/CNT conductive bridge random access memory for neuromorphic engineeringopen access
- Authors
- Kim, Jihyung; Choi, Jin Hyeong; Kim, Sunghun; Choi, Changsoon; Kim, Sungjun
- Issue Date
- Nov-2023
- Publisher
- Elsevier Ltd
- Keywords
- Conductive bridge random access memory; Long-term memory; Memristor; Neuromorphic engineering; Short-term memory; Synaptic device
- Citation
- Carbon, v.215, pp 1 - 10
- Pages
- 10
- Indexed
- SCIE
SCOPUS
- Journal Title
- Carbon
- Volume
- 215
- Start Page
- 1
- End Page
- 10
- URI
- https://scholarworks.dongguk.edu/handle/sw.dongguk/21047
- DOI
- 10.1016/j.carbon.2023.118438
- ISSN
- 0008-6223
1873-3891
- Abstract
- This work presents the resistive switching characteristics of the TaOx-based conductive-bridge random-access memory (CBRAM) for neuromorphic engineering. Controlling the Cu filament inside the TaOx film allows the device to operate as both volatile and nonvolatile memory. For volatile switching induced by a lower compliance current (Icc), a threshold switching operation is observed. Upon completion of the set process, the retention and current decay were observed, suggesting that the device has the potential for short-term memory applications. Increasing Icc enables the CBRAM to act as a memory-switching device, as confirmed by the lengthy retention time of up to 104 s. Additionally, short-term memory (STM) and long-term memory (LTM) of the device were demonstrated by time-dependent memory decay, where the various magnitude differences of the time-dependent operations. STM was identified by applying two identical pulses to the device to mimic the paired-pulse facilitation (PPF) of the neural system. Furthermore, long-term potentiation and depression were accomplished via consequent identical pulse stimuli under different switching modes to demonstrate stable LTM properties. © 2023 Elsevier Ltd
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Collections - College of Engineering > Department of Electronics and Electrical Engineering > 1. Journal Articles
- College of Engineering > ETC > 1. Journal Articles

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