Cited 18 time in
All-sputtered oxide thin-film transistors fabricated at 150 degrees C using simultaneous ultraviolet and thermal treatment
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Tak, Young Jun | - |
| dc.contributor.author | Kim, Si Joon | - |
| dc.contributor.author | Kwon, Sera | - |
| dc.contributor.author | Kim, Hee Jun | - |
| dc.contributor.author | Chung, Kwun-Bum | - |
| dc.contributor.author | Kim, Hyun Jae | - |
| dc.date.accessioned | 2023-04-28T09:42:19Z | - |
| dc.date.available | 2023-04-28T09:42:19Z | - |
| dc.date.issued | 2018-01-14 | - |
| dc.identifier.issn | 2050-7526 | - |
| dc.identifier.issn | 2050-7534 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/9816 | - |
| dc.description.abstract | In this study, we report all-sputtered In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) through the fabrication of a sputtered gate insulator. Furthermore, using simultaneous UV and thermal (SUT) treatment, we fabricate sputter-processed gate insulators at a low temperature of 150 degrees C with a higher amount of coordinated oxygen species and a higher surface energy than thermal-only (300 degrees C) treated gate insulators. Additionally, by activating the IGZO channel layer using SUT treatments, we fabricate all-sputter processed IGZO TFTs at 150 degrees C and they exhibit improved device performances compared to thermal-only treated ones; the field-effect mobility is increased from 7.32 +/- 3.8 to 29.59 +/- 2.5 cm(2) V-1 s(-1), the on/off ratio is increased from (1.1 +/- 1.8) x 10(5) to (2.9 +/- 1.7) x 10(8), and the subthreshold swing is decreased from 1.0 +/- 0.07 to 0.4 +/- 0.05 V dec(-1). | - |
| dc.format.extent | 8 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | ROYAL SOC CHEMISTRY | - |
| dc.title | All-sputtered oxide thin-film transistors fabricated at 150 degrees C using simultaneous ultraviolet and thermal treatment | - |
| dc.type | Article | - |
| dc.publisher.location | 영국 | - |
| dc.identifier.doi | 10.1039/c7tc04642a | - |
| dc.identifier.scopusid | 2-s2.0-85040251396 | - |
| dc.identifier.wosid | 000419317900007 | - |
| dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS CHEMISTRY C, v.6, no.2, pp 249 - 256 | - |
| dc.citation.title | JOURNAL OF MATERIALS CHEMISTRY C | - |
| dc.citation.volume | 6 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 249 | - |
| dc.citation.endPage | 256 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | TEMPERATURE | - |
| dc.subject.keywordPlus | STABILITY | - |
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