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Microstructural and electrical properties evaluation of lead doped tin sulfide thin films

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dc.contributor.authorSebastian, S.-
dc.contributor.authorKulandaisamy, I-
dc.contributor.authorValanarasu, S.-
dc.contributor.authorYahia, I. S.-
dc.contributor.authorKim, Hyun-Seok-
dc.contributor.authorVikraman, Dhanasekaran-
dc.date.accessioned2023-04-28T00:40:59Z-
dc.date.available2023-04-28T00:40:59Z-
dc.date.issued2020-01-
dc.identifier.issn0928-0707-
dc.identifier.issn1573-4846-
dc.identifier.urihttps://scholarworks.dongguk.edu/handle/sw.dongguk/7035-
dc.description.abstractA low cost and simple spray methodology with nebulizer was employed to fabricate lead doped tin sulfide (SnS:Pb) thin films. Different doping weight percentages (1, 3, 5, 7, and 9 wt%) were used to prepare SnS:Pb thin films on glass substrates with 350 degrees C substrate temperature, and we subsequently investigated Pb element influence on microstructural, electrical, and optical properties. Structural studies using X-ray diffraction confirmed orthorhombic crystal structure with (111) plane preferred orientation and atomic force micrographs identified significant variation due to the different Pb wt%. Photoluminescence showed a strong band edge emission peak at 761 nm, with optical band gaps at 1.90-1.60 eV over the Pb dopant concentrations. Hall effect showed low electrical resistivity (3.01 x 10(-2) Omega cm), high carrier concentration (similar to 1.01 x 10(19) cm(-3)), and high Hall mobility (similar to 20.5 cm(2) V-1 s(-1)) for 7 wt%, which is suitable to fabricate solar cell devices. The p-n junction properties were analyzed under dark and illumination conditions by current-voltage characteristics using the FTO/n-CdS/p-SnS:Pb/Al structure. [GRAPHICS] .-
dc.format.extent10-
dc.language영어-
dc.language.isoENG-
dc.publisherSPRINGER-
dc.titleMicrostructural and electrical properties evaluation of lead doped tin sulfide thin films-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1007/s10971-019-05169-y-
dc.identifier.scopusid2-s2.0-85074748192-
dc.identifier.wosid000494010200001-
dc.identifier.bibliographicCitationJOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.93, no.1, pp 52 - 61-
dc.citation.titleJOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY-
dc.citation.volume93-
dc.citation.number1-
dc.citation.startPage52-
dc.citation.endPage61-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryMaterials Science, Ceramics-
dc.subject.keywordPlusNEBULIZER SPRAY-PYROLYSIS-
dc.subject.keywordPlusPHYSICAL-PROPERTIES-
dc.subject.keywordPlusPHOTOCURRENT-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusDEPOSITION-
dc.subject.keywordPlusNANORODS-
dc.subject.keywordPlusLAYERS-
dc.subject.keywordAuthorSnS:Pb-
dc.subject.keywordAuthorThin film-
dc.subject.keywordAuthorXRD-
dc.subject.keywordAuthorMicrostructural-
dc.subject.keywordAuthorResistivity-
dc.subject.keywordAuthorp-n junction-
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