BGA 반도체용 봉지재의 몰딩공정 모사

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BGA 반도체용 봉지재의 몰딩공정 모사

Authors: 이명천

Issue Date: 12-May-2000

URI: https://scholarworks.dongguk.edu/handle/sw.dongguk/36827

Place: 대한민국

Conference Date: 2000-05-12 ~ 2000-05-13

Conference Name: 한국공업화학회 춘계 발표회

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Appears in Collections: College of Engineering > Department of Chemical and Biochemical Engineering > 2. Conference Papers

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