Comparison of Recessed Gate-Head Structures on Normally-Off AlGaN/GaN High-Electron-Mobility Transistor Performance
- Authors
- Khan, Mansoor Ali; Heo, Jun-Woo; Kim, Hyun-Seok; Park, Hyun-Chang
- Issue Date
- Nov-2014
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- High-Electron-Mobility Transistor (HEMT); Gallium Nitride (GaN); Field Plate (FP); Recessed Gate
- Citation
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.11, pp 8141 - 8147
- Pages
- 7
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Volume
- 14
- Number
- 11
- Start Page
- 8141
- End Page
- 8147
- URI
- https://scholarworks.dongguk.edu/handle/sw.dongguk/23525
- DOI
- 10.1166/jnn.2014.9897
- ISSN
- 1533-4880
1533-4899
- Abstract
- In this work, different gate-head structures have been compared in the context of AlGaN/GaN-based high-electron-mobility transistors (HEMTs). Field-plate (FP) technology self-aligned to the gate electrode leads to various gate-head structures, most likely gamma (Gamma)-gate, camel (-)-gate, and mushroom-shaped (T)-gate. In-depth comparison of recessed gate-head structures demonstrated that key performance metrics such as transconductance, output current, and breakdown voltage are better with the T-gate head structure. The recessed T-gate with its one arm toward the source side not only reduces the source-access resistance (R-g + R-gs), but also minimizes the source-side dispersion and current leakage, resulting in high transconductance (G(m)) and output current (I-DS). At the same time, the other arm toward the drain-side reduces the drain-side dispersion and tends to distribute electric field peaks uniformly, resulting in high breakdown voltage (V-BR). DC and RF analysis showed that the recessed T-gate FP-HEMT is a suitable candidate not only for high-frequency operation, but also for high-power applications.
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