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Comparison of Recessed Gate-Head Structures on Normally-Off AlGaN/GaN High-Electron-Mobility Transistor Performance

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dc.contributor.authorKhan, Mansoor Ali-
dc.contributor.authorHeo, Jun-Woo-
dc.contributor.authorKim, Hyun-Seok-
dc.contributor.authorPark, Hyun-Chang-
dc.date.accessioned2024-09-25T03:01:37Z-
dc.date.available2024-09-25T03:01:37Z-
dc.date.issued2014-11-
dc.identifier.issn1533-4880-
dc.identifier.issn1533-4899-
dc.identifier.urihttps://scholarworks.dongguk.edu/handle/sw.dongguk/23525-
dc.description.abstractIn this work, different gate-head structures have been compared in the context of AlGaN/GaN-based high-electron-mobility transistors (HEMTs). Field-plate (FP) technology self-aligned to the gate electrode leads to various gate-head structures, most likely gamma (Gamma)-gate, camel (-)-gate, and mushroom-shaped (T)-gate. In-depth comparison of recessed gate-head structures demonstrated that key performance metrics such as transconductance, output current, and breakdown voltage are better with the T-gate head structure. The recessed T-gate with its one arm toward the source side not only reduces the source-access resistance (R-g + R-gs), but also minimizes the source-side dispersion and current leakage, resulting in high transconductance (G(m)) and output current (I-DS). At the same time, the other arm toward the drain-side reduces the drain-side dispersion and tends to distribute electric field peaks uniformly, resulting in high breakdown voltage (V-BR). DC and RF analysis showed that the recessed T-gate FP-HEMT is a suitable candidate not only for high-frequency operation, but also for high-power applications.-
dc.format.extent7-
dc.language영어-
dc.language.isoENG-
dc.publisherAMER SCIENTIFIC PUBLISHERS-
dc.titleComparison of Recessed Gate-Head Structures on Normally-Off AlGaN/GaN High-Electron-Mobility Transistor Performance-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1166/jnn.2014.9897-
dc.identifier.scopusid2-s2.0-84908528810-
dc.identifier.wosid000344126500004-
dc.identifier.bibliographicCitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.11, pp 8141 - 8147-
dc.citation.titleJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY-
dc.citation.volume14-
dc.citation.number11-
dc.citation.startPage8141-
dc.citation.endPage8147-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryChemistry, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusBREAKDOWN VOLTAGE-
dc.subject.keywordPlusHEMTS-
dc.subject.keywordPlusENHANCEMENT-
dc.subject.keywordPlusOPERATION-
dc.subject.keywordPlusGANHFET-
dc.subject.keywordPlusDC-
dc.subject.keywordAuthorHigh-Electron-Mobility Transistor (HEMT)-
dc.subject.keywordAuthorGallium Nitride (GaN)-
dc.subject.keywordAuthorField Plate (FP)-
dc.subject.keywordAuthorRecessed Gate-
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