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Cited 77 time in webofscience Cited 85 time in scopus
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Flexible Multimodal Sensors for Electronic Skin: Principle, Materials, Device, Array Architecture, and Data Acquisition Method

Authors
Jeon, SanghunLim, Soo-ChulTran Quang TrungJung, MinhyunLee, Nae-Eung
Issue Date
Oct-2019
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Metals; Skin; Sensor arrays; Biomedical monitoring; Robot sensing systems; Temperature sensors; Electronic skin (e-skin); flexible and stretchable device; multimodal sensor; sensor network; wearable device
Citation
PROCEEDINGS OF THE IEEE, v.107, no.10, pp 2065 - 2083
Pages
19
Indexed
SCI
SCIE
SCOPUS
Journal Title
PROCEEDINGS OF THE IEEE
Volume
107
Number
10
Start Page
2065
End Page
2083
URI
https://scholarworks.dongguk.edu/handle/sw.dongguk/18715
DOI
10.1109/JPROC.2019.2930808
ISSN
0018-9219
1558-2256
Abstract
Electronic skin (e-skin) is designed to mimic the comprehensive nature of human skin. Various advances in e-skin continue to drive the development of the multimodal tactile sensor technology on flexible and stretchable platforms. e-skin incorporates pressure, temperature, texture, photographic imaging, and other sensors as well as data acquisition and signal processing units formed on a soft substrate for humanoid robots, wearable devices, and health monitoring electronics that are the most critical applications of soft electronics. This artificial skin has developed very rapidly toward becoming real technology. However, the complex nature of e-skin technology presents significant challenges in terms of materials, devices, sophisticated integration methods, and interference-free data acquisition. These challenges range from functional materials, device architecture, pixel design, array structure, and data acquisition method to multimodal sensing performance with negligible interference. In this article, we present recent research trends and approaches in the field of flexible and stretchable multimodal sensors for e-skin focusing on the following aspects: 1) flexible and stretchable platforms; 2) operating principles and materials suitable for pressure, temperature, strain, photograph, and hairy sensor devices; 3) device and integration architectures, including multimodal single cells, three-axis tactile sensors, vertical-stacked sensor arrays, active matrix sensor arrays, and integration electronics; 4) reliable acquisition methods for various texture sensing and machine-learning algorithms for processing tactile sensing data; and 5) future outlook.
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