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Fast Chip-Package-PCB Coanalysis Methodology for Power Integrity of Multi-Domain High-Speed Memory: A Case Study
- Authors
- 한기진
- Issue Date
- 19-Mar-2018
- Place
- 독일
- Conference Date
- 2018-03-19 ~ 2018-03-23
- Conference Name
- Design, Automation & Test in Europe Conference & Exhibition (DATE), 2018
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Related Researcher
- Han, Ki Jin
- College of Engineering (Department of Electronics and Electrical Engineering)