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Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligandsopen access

Lee, Chae Sung; Kim, BeomJong; Jeon, Seongun; Han, Cheul Jong; Hong, Sung-Kyu

ArticleIssue Date2013CitationBULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.34, no.12, pp 3787 - 3789PublisherKOREAN CHEMICAL SOC
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