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Fast Chip-Package-PCB Coanalysis Methodology for Power Integrity of Multi-Domain High-Speed Memory: A Case Study
- 제목
- Fast Chip-Package-PCB Coanalysis Methodology for Power Integrity of Multi-Domain High-Speed Memory: A Case Study
- 저자
- 한기진
- 발행일
- 2018-03-19
- 학회명
- Design, Automation & Test in Europe Conference & Exhibition (DATE), 2018
- 개최국가
- 독일
- 학회 개최일
- 2018-03-19 ~ 2018-03-23