ScholarWorks@동국대학교

상세 보기

Modified Pad Pattern for CPW Milimeterwave Flip chip

  • 이진구
제목
Modified Pad Pattern for CPW Milimeterwave Flip chip
저자
이진구
발행일
2001-04-18
학회명
ICEP(International Conference on Electronics Packaging, Formerly IEMT/IMC Sympos
개최지
Tokyo
개최국가
일본
학회 개최일
2001-04-18 ~ 2001-04-20

ScholarWorks@동국대학교

04620 서울특별시 중구 필동로 1길 30 동국대학교 Tel. 02-2260-3114

COPYRIGHT © 동국대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.