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Optimization of High-Speed Package Design on Statistical Domain
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Il-Joon | - |
| dc.contributor.author | Lee, Manho | - |
| dc.contributor.author | Han, Ki Jin | - |
| dc.contributor.author | Kim, Gyoungbum | - |
| dc.contributor.author | Kim, Dae-Woo | - |
| dc.contributor.author | Oh, Dan | - |
| dc.date.accessioned | 2023-04-28T01:40:29Z | - |
| dc.date.available | 2023-04-28T01:40:29Z | - |
| dc.date.issued | 2020-06 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.issn | 2377-5726 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/7183 | - |
| dc.description.abstract | This paper proposes an effective methodology to figure out the domain of design parameters for given electrical target specifications to have design rules for high-speed package design. Since the exact domain of the parameters is arbitrary and it is difficult to describe accurately, we change this problem by utilizing probability domain. Not only uniformly parametric sampling, but also Monte-Carlo sampling are simulated, and analyzed statistically on probability domain. An optimization algorithm maximizes the parameter domain for a target specification. LPDDR memory channel model constructed for parametric simulation include I/O interface and passive components. Computational script generator for HSPICE simulation is developed to perform parametric simulation and statistical analysis. During the procedure, the problem of using harsh computational burden due to a large number of samplings is resolved by reusing previously sampled data. The proposed methodology can provide a practical and quantitative guideline for high-speed package design. Moreover, the proposed modeling and analysis is unique methodology which is not tied to a specific topology such as conventional modeling and analysis. | - |
| dc.format.extent | 6 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | IEEE COMPUTER SOC | - |
| dc.title | Optimization of High-Speed Package Design on Statistical Domain | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00157 | - |
| dc.identifier.scopusid | 2-s2.0-85090287718 | - |
| dc.identifier.wosid | 000620983200145 | - |
| dc.identifier.bibliographicCitation | 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), v.2020-June, pp 964 - 969 | - |
| dc.citation.title | 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) | - |
| dc.citation.volume | 2020-June | - |
| dc.citation.startPage | 964 | - |
| dc.citation.endPage | 969 | - |
| dc.type.docType | Proceedings Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.subject.keywordAuthor | Packaging | - |
| dc.subject.keywordAuthor | optimization | - |
| dc.subject.keywordAuthor | parametrization | - |
| dc.subject.keywordAuthor | mobile DRAM | - |
| dc.subject.keywordAuthor | LPDDR | - |
| dc.subject.keywordAuthor | Signal Integrity | - |
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