Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
플립칩 실장용 코플래너 도파관 구조의 인쇄 회로 기판패턴
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이진구 | - |
| dc.date.accessioned | 2025-11-05T01:46:39Z | - |
| dc.date.available | 2025-11-05T01:46:39Z | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/62000 | - |
| dc.title | 플립칩 실장용 코플래너 도파관 구조의 인쇄 회로 기판패턴 | - |
| dc.type | Patent | - |
| dc.publisher.location | 대한민국 | - |
| dc.contributor.assignee | 학교법인 동국학원;동국대학교산학협력단;이진구;박현식;권혁철 | - |
| dc.date.application | 2001-01-29 | - |
| dc.date.registration | 2002-10-23 | - |
| dc.type.iprs | 특허 | - |
| dc.identifier.patentRegistrationNumber | 10-0359668-00-00 | - |
| dc.identifier.patentApplicationNumber | 10-2001-0004101 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - ETC > 4. Patents
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.