Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
표면 멤스 기술을 이용한 다공성 실리콘 기반마이크로스트립 전송선로
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이진구 | - |
| dc.date.accessioned | 2025-11-05T01:46:25Z | - |
| dc.date.available | 2025-11-05T01:46:25Z | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/61971 | - |
| dc.title | 표면 멤스 기술을 이용한 다공성 실리콘 기반마이크로스트립 전송선로 | - |
| dc.type | Patent | - |
| dc.publisher.location | 대한민국 | - |
| dc.contributor.assignee | 동국대학교산학협력단 | - |
| dc.date.application | 2003-11-21 | - |
| dc.date.registration | 2006-05-08 | - |
| dc.type.iprs | 특허 | - |
| dc.identifier.patentRegistrationNumber | 10-0579441-00-00 | - |
| dc.identifier.patentApplicationNumber | 10-2003-0082841 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - ETC > 4. Patents
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.