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골드 범프를 이용한 밀리미터파 대역의 MMIC 칩의 온-웨이퍼 (on-wafer) 측정 장치 개발
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이상진 | - |
| dc.contributor.author | 이진구 | - |
| dc.date.accessioned | 2025-09-09T06:32:47Z | - |
| dc.date.available | 2025-09-09T06:32:47Z | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/59293 | - |
| dc.description.abstract | 본 발명은 베어칩 (bare-chip)의 온-웨이퍼 (on-wafer) 측정 장치와 관련된 발명이다. | - |
| dc.title | 골드 범프를 이용한 밀리미터파 대역의 MMIC 칩의 온-웨이퍼 (on-wafer) 측정 장치 개발 | - |
| dc.title.alternative | On-wafer measurement instrument for millimeter-wave MMIC with gold bump | - |
| dc.type | Patent | - |
| dc.publisher.location | 대한민국 | - |
| dc.contributor.assignee | 동국대학교산학협력단 | - |
| dc.date.application | 2010-12-27 | - |
| dc.date.registration | 2012-08-01 | - |
| dc.type.iprs | 특허 | - |
| dc.identifier.patentRegistrationNumber | 10-1171959-00-00 | - |
| dc.identifier.patentApplicationNumber | 10-2010-0135978 | - |
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