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전자 제품 응용을 위한 조인트와 경계에서의 균열 발생 및 전파 연구
- Authors
- 김흥수
- Issue Date
- 6-Apr-2017
- Place
- 대한민국
- Conference Name
- 2017 한국전산구조공학회 정기학술대회
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Related Researcher
- Kim, Heung Soo
- College of Engineering (Department of Mechanical, Robotics and Energy Engineering)