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수분 이동을 고려한 종이의 컬 현상 해석
- Authors
- 이승준
- Issue Date
- 7-Apr-2017
- Place
- 대한민국
- Conference Name
- 2017 한국전산구조공학회 정기학술대회
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Related Researcher
- Lee, Seung Jun
- College of Engineering (Department of Mechanical, Robotics and Energy Engineering)