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Structural and Mechanical Characterization of Platinum Thin Films Prepared Electrochemically on ITO/Glass Substrate

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dc.contributor.authorKathalingam, A.-
dc.contributor.authorMarimuthu, Karuppasamy Pandian-
dc.contributor.authorKaruppasamy, K.-
dc.contributor.authorChae, Yeon-Sik-
dc.contributor.authorLee, Hyungyil-
dc.contributor.authorPark, Hyun-Chang-
dc.contributor.authorKim, Hyun-Seok-
dc.date.accessioned2023-04-27T17:40:31Z-
dc.date.available2023-04-27T17:40:31Z-
dc.date.issued2021-06-
dc.identifier.issn1598-9623-
dc.identifier.issn2005-4149-
dc.identifier.urihttps://scholarworks.dongguk.edu/handle/sw.dongguk/4900-
dc.description.abstractWe report the structural characterization and nanomechanical properties of platinum (Pt) thin films prepared through facile electrochemical synthesis. The Pt thin films were coated onto indium tin oxide (ITO)/glass substrates by two-electrode electrochemical deposition at room temperature. They were characterized using X-ray diffraction, scanning electron microscopy, and atomic force microscopy for structural and morphological analyses. Indentation depth-dependent hardness and elastic modulus of the prepared films were analyzed using the nanoindentation technique. Furthermore, the mechanical properties of the ITO/glass substrates were also investigated to understand the influence of the substrate on the film properties. The prepared films showed reasonable mechanical and structural properties suitable for device applications. Finally, the photoconductivity effect of the prepared Pt film was also studied to determine its suitability for device applications. The Pt film was also coated on Cu plates to check substrates effects on this electrochemical deposition, and found that the Cu plates produced well adherent smooth films. Graphic-
dc.format.extent11-
dc.language영어-
dc.language.isoENG-
dc.publisherKOREAN INST METALS MATERIALS-
dc.titleStructural and Mechanical Characterization of Platinum Thin Films Prepared Electrochemically on ITO/Glass Substrate-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.doi10.1007/s12540-019-00527-5-
dc.identifier.scopusid2-s2.0-85075192658-
dc.identifier.wosid000496215000004-
dc.identifier.bibliographicCitationMETALS AND MATERIALS INTERNATIONAL, v.27, no.6, pp 1554 - 1564-
dc.citation.titleMETALS AND MATERIALS INTERNATIONAL-
dc.citation.volume27-
dc.citation.number6-
dc.citation.startPage1554-
dc.citation.endPage1564-
dc.type.docTypeArticle-
dc.identifier.kciidART002721777-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusELASTIC-MODULUS-
dc.subject.keywordPlusINDENTATION-
dc.subject.keywordPlusHARDNESS-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordAuthorFilm characterization-
dc.subject.keywordAuthorElectrochemical synthesis-
dc.subject.keywordAuthorNanoindentation-
dc.subject.keywordAuthorPlatinum thin films-
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