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Reduction of Free-edge Peeling Stress in Laminated composites using Thermal Gradient
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김흥수 | - |
| dc.date.accessioned | 2024-10-30T11:42:45Z | - |
| dc.date.available | 2024-10-30T11:42:45Z | - |
| dc.date.issued | 2012-09-12 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/46872 | - |
| dc.title | Reduction of Free-edge Peeling Stress in Laminated composites using Thermal Gradient | - |
| dc.type | Conference | - |
| dc.citation.startPage | 1 | - |
| dc.citation.endPage | 2 | - |
| dc.citation.conferenceName | KSME-JSME Joint Symposium on CM & CAE 2012 | - |
| dc.citation.conferencePlace | 대한민국 | - |
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Related Researcher
- Kim, Heung Soo
- College of Engineering (Department of Mechanical, Robotics and Energy Engineering)