properties of UV-curable solvent free pressure sensitive adhesive
Full metadata record
| DC Field |
Value |
Language |
| dc.contributor.author | 이명천 | - |
| dc.date.accessioned | 2024-10-30T08:03:05Z | - |
| dc.date.available | 2024-10-30T08:03:05Z | - |
| dc.date.issued | 2010-10-28 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/43769 | - |
| dc.title | properties of UV-curable solvent free pressure sensitive adhesive | - |
| dc.type | Conference | - |
| dc.citation.startPage | 128 | - |
| dc.citation.endPage | 128 | - |
| dc.citation.conferenceName | 한국공업화학회 추계 학술대회 | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferencePlace | 대전 | - |
| dc.citation.conferenceDate | 2010-10-27 ~ 2010-10-29 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > Department of Chemical and Biochemical Engineering > 2. Conference Papers

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.