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SM520 TMC 후판강재의 인성 및 용접특성에 관한 연구
- Authors
- 김규석
- Issue Date
- 12-Jun-1999
- Place
- 대한민국
서울
- Conference Date
- 1999-06-12
- Conference Name
- 한국강구조학회 학술발표회
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