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BGA 반도체용 봉지재의 몰딩 공정 모사
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이의수 | - |
| dc.date.accessioned | 2024-10-30T02:31:42Z | - |
| dc.date.available | 2024-10-30T02:31:42Z | - |
| dc.date.issued | 2000-05-12 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/37081 | - |
| dc.title | BGA 반도체용 봉지재의 몰딩 공정 모사 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국공업화학회 춘계 논문 발표회 | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferencePlace | 서울산업대학교/서울 | - |
| dc.citation.conferenceDate | 2000-05-12 ~ 2000-05-13 | - |
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