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Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligands
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Chae Sung | - |
| dc.contributor.author | Kim, BeomJong | - |
| dc.contributor.author | Jeon, Seongun | - |
| dc.contributor.author | Han, Cheul Jong | - |
| dc.contributor.author | Hong, Sung-Kyu | - |
| dc.date.accessioned | 2024-09-25T03:31:54Z | - |
| dc.date.available | 2024-09-25T03:31:54Z | - |
| dc.date.issued | 2013-12-20 | - |
| dc.identifier.issn | 0253-2964 | - |
| dc.identifier.issn | 1229-5949 | - |
| dc.identifier.uri | https://scholarworks.dongguk.edu/handle/sw.dongguk/23690 | - |
| dc.description.abstract | In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand. | - |
| dc.format.extent | 3 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | KOREAN CHEMICAL SOC | - |
| dc.title | Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligands | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.doi | 10.5012/bkcs.2013.34.12.3787 | - |
| dc.identifier.scopusid | 2-s2.0-84891368913 | - |
| dc.identifier.wosid | 000329144600046 | - |
| dc.identifier.bibliographicCitation | BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.34, no.12, pp 3787 - 3789 | - |
| dc.citation.title | BULLETIN OF THE KOREAN CHEMICAL SOCIETY | - |
| dc.citation.volume | 34 | - |
| dc.citation.number | 12 | - |
| dc.citation.startPage | 3787 | - |
| dc.citation.endPage | 3789 | - |
| dc.type.docType | Article | - |
| dc.identifier.kciid | ART001826674 | - |
| dc.description.isOpenAccess | Y | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.relation.journalResearchArea | Chemistry | - |
| dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
| dc.subject.keywordPlus | LUMINESCENT | - |
| dc.subject.keywordPlus | PHOTOLUMINESCENCE | - |
| dc.subject.keywordPlus | NANOCRYSTALLITES | - |
| dc.subject.keywordPlus | COMPOSITES | - |
| dc.subject.keywordPlus | SPECTRUM | - |
| dc.subject.keywordAuthor | Quantum dot | - |
| dc.subject.keywordAuthor | Silicone encapsulant | - |
| dc.subject.keywordAuthor | Ligand | - |
| dc.subject.keywordAuthor | Thermal curing degree | - |
| dc.subject.keywordAuthor | TOPO | - |
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Related Researcher
- Hong, Sung Kyu
- College of Engineering (Department of Chemical and Biochemical Engineering)