Assessment of candidate metallization systems deposited on diamond using nano-indentation and nano-scratching tests
- Authors
- Msolli, S.; Alexis, J.; Kim, H. S.; Dalverny, O.; Karama, M.
- Issue Date
- 30-Nov-2016
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Diamond; Metallization; Deposition; Nano-indentation; Nano-scratching; Power electronics
- Citation
- THIN SOLID FILMS, v.619, pp 53 - 60
- Pages
- 8
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 619
- Start Page
- 53
- End Page
- 60
- URI
- https://scholarworks.dongguk.edu/handle/sw.dongguk/23465
- DOI
- 10.1016/j.tsf.2016.10.022
- ISSN
- 0040-6090
1879-2731
- Abstract
- Mechanical suitability of ohmic contacts among the select metallization systems, deposited on a p-type heavily boron-doped homoepitaxial diamond layer, was evaluated via mechanical tests on the nanoscale. Two candidate metallization systems were considered: Si/Al and Ti/Pt/Au. Metallizations were performed using two different techniques: plasma-enhanced chemical vapour deposition and "lift-off". Effectiveness of the techniques was assessed via mechanical tests on the microscale and the nanoscale. Nano-indentation experiments were performed to determine the mechanical properties of the layers. Nano-scratching experiments were used to evaluate the mechanical adhesion on the diamond substrate. Scanning electron microscopy was applied for observation of the morphology of the surface and the indent and for detecting defects. (C) 2016 Elsevier B.V. All rights reserved.
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Collections - College of Engineering > Department of Mechanical, Robotics and Energy Engineering > 1. Journal Articles

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