LED 모듈 표준 표시사항의 경제적인 평가를 위한 단일 핀 방열 블록의 냉각성능 예측

Abstract

LED has received intensive research attention due to its long life, high efficacy, fast response and wide colour availability, and has secured extensive application areas. However, LED chips within the modules convert only fraction of electric energy into light, and majority of supplied energy needs to be dissipated as heat, which challenges in the performance and life of the LED modules. IEC 62717 specifies the performance requirements for LED modules together with the test methods and conditions. The present study examined the influence of different design parameters on performance temperature through series of experiments and numerical simulations. The economic means to change the module performance temperature during the measurement of mandatory markings were suggested based on predicted cooling performances.