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Cited 4 time in webofscience Cited 4 time in scopus
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A Phase-Canceled Backing Layer for Ultrasound Linear Array Transducer: Modeling and Experimental Verification

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dc.contributor.authorKwon, Da Sol-
dc.contributor.authorSung, Jin Ho-
dc.contributor.authorPark, Chan Yuk-
dc.contributor.authorJeong, Eun Young-
dc.contributor.authorJeong, Jong Seob-
dc.date.accessioned2024-08-08T07:30:34Z-
dc.date.available2024-08-08T07:30:34Z-
dc.date.issued2020-04-
dc.identifier.issn0885-3010-
dc.identifier.issn1525-8955-
dc.identifier.urihttps://scholarworks.dongguk.edu/handle/sw.dongguk/19507-
dc.description.abstractIn this study, a phase-canceled backing layer for ultrasound linear array transducer is presented. The proposed backing layer is composed of multiple blocks operated by a phase inversion technique. Inside the proposed backing layer, the phase of the reflected signals can be canceled by adjusting acoustic impedance, piezoelectric layer contact area, and thickness of each block constituting the backing layer. Therefore, the total thickness of the backing layer can be significantly reduced while maintaining the performance. Using finite element analysis (FEA) simulation, its performance was verified based on an 8-MHz linear array transducer. Two types of bulk-type backing layers with different thicknesses were also simulated to compare the performance of the proposed method. In the case of a narrow bandwidth signal without the matching layers, the 10-mm-thick bulk-type backing layer yielded a -6-dB bandwidth of 37.2%. When its thickness was reduced to 2 mm, the -6-dB bandwidth was decreased to 17.3% due to the reflected back-wall signals. However, the -6-dB bandwidth of the proposed backing layer with 2-mm thickness was 39.5%, which is similar to the thick bulk-type backing layer. In the case of broad bandwidth signal with the matching layers, the proposed transducer also exhibits similar performance compared with the thick bulk-type backing layer. The narrow bandwidth signal was experimentally implemented by using a prototype array transducer with the proposed technique, and the performance was similar to the simulation. Thus, the proposed method can reduce the thickness of the backing layer of various array transducers.-
dc.format.extent9-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleA Phase-Canceled Backing Layer for Ultrasound Linear Array Transducer: Modeling and Experimental Verification-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TUFFC.2019.2950928-
dc.identifier.scopusid2-s2.0-85082562158-
dc.identifier.wosid000522170700009-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.67, no.4, pp 770 - 778-
dc.citation.titleIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL-
dc.citation.volume67-
dc.citation.number4-
dc.citation.startPage770-
dc.citation.endPage778-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaAcoustics-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryAcoustics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusEPOXY-
dc.subject.keywordPlusATTENUATION-
dc.subject.keywordPlusCOMPOSITES-
dc.subject.keywordPlusAGENT-
dc.subject.keywordAuthorTransducers-
dc.subject.keywordAuthorUltrasonic imaging-
dc.subject.keywordAuthorAcoustics-
dc.subject.keywordAuthorBandwidth-
dc.subject.keywordAuthorImpedance-
dc.subject.keywordAuthorFinite element analysis-
dc.subject.keywordAuthorImaging-
dc.subject.keywordAuthorFinite element analysis (FEA) simulation-
dc.subject.keywordAuthorphase inversion technique-
dc.subject.keywordAuthorphase-canceled backing layer-
dc.subject.keywordAuthorultrasound linear array transducer-
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